JPH0717162Y2 - フレキシブルプリント基板 - Google Patents

フレキシブルプリント基板

Info

Publication number
JPH0717162Y2
JPH0717162Y2 JP1988063902U JP6390288U JPH0717162Y2 JP H0717162 Y2 JPH0717162 Y2 JP H0717162Y2 JP 1988063902 U JP1988063902 U JP 1988063902U JP 6390288 U JP6390288 U JP 6390288U JP H0717162 Y2 JPH0717162 Y2 JP H0717162Y2
Authority
JP
Japan
Prior art keywords
connection terminal
pattern
circuit board
printed circuit
flexible printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988063902U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01167074U (en]
Inventor
俊二 奥
明和 古匠
Original Assignee
ミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミノルタ株式会社 filed Critical ミノルタ株式会社
Priority to JP1988063902U priority Critical patent/JPH0717162Y2/ja
Priority to US07/351,646 priority patent/US4958050A/en
Publication of JPH01167074U publication Critical patent/JPH01167074U/ja
Application granted granted Critical
Publication of JPH0717162Y2 publication Critical patent/JPH0717162Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09245Crossing layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP1988063902U 1988-05-13 1988-05-13 フレキシブルプリント基板 Expired - Lifetime JPH0717162Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988063902U JPH0717162Y2 (ja) 1988-05-13 1988-05-13 フレキシブルプリント基板
US07/351,646 US4958050A (en) 1988-05-13 1989-05-12 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063902U JPH0717162Y2 (ja) 1988-05-13 1988-05-13 フレキシブルプリント基板

Publications (2)

Publication Number Publication Date
JPH01167074U JPH01167074U (en]) 1989-11-22
JPH0717162Y2 true JPH0717162Y2 (ja) 1995-04-19

Family

ID=13242713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063902U Expired - Lifetime JPH0717162Y2 (ja) 1988-05-13 1988-05-13 フレキシブルプリント基板

Country Status (2)

Country Link
US (1) US4958050A (en])
JP (1) JPH0717162Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19619891C2 (de) * 1996-05-17 2001-07-26 Gkn Viscodrive Gmbh Vorrichtung zur Steuerung einer Kupplung

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59009156D1 (de) * 1990-12-18 1995-06-29 Siemens Ag Hörgerät.
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
US5276590A (en) * 1991-10-24 1994-01-04 International Business Machines Corporation Flex circuit electronic cards
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
US5376232A (en) * 1993-08-23 1994-12-27 Parlex Corporation Method of manufacturing a printed circuit board
US6118666A (en) * 1998-01-12 2000-09-12 Asahi Kogaku Kogyo Kabushiki Kaisha Flexible printed wiring board and connecting structure thereof
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US7378596B2 (en) * 2003-04-18 2008-05-27 Ibiden Co., Ltd. Rigid-flex wiring board
JP4062168B2 (ja) * 2003-05-19 2008-03-19 ソニー株式会社 端子部材の構造
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板
JP4399337B2 (ja) * 2004-09-13 2010-01-13 株式会社フューチャービジョン 平面パターンを有する基板およびそれを用いた表示装置
JP2008186843A (ja) * 2007-01-26 2008-08-14 Olympus Corp フレキシブル基板の接合構造
CN103338582A (zh) * 2013-05-20 2013-10-02 业成光电(深圳)有限公司 软性电路板以及使用该软性电路板的电子装置
JP5767290B2 (ja) * 2013-07-26 2015-08-19 株式会社フジクラ フレキシブルプリント基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4113981A (en) * 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
US4252391A (en) * 1979-06-19 1981-02-24 Shin-Etsu Polymer Co., Ltd. Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof
AU572615B2 (en) * 1983-12-27 1988-05-12 Sony Corporation Electrically conductive adhesive sheet circuit board and electrical connection structure
GB2166603B (en) * 1984-09-28 1988-07-20 Yazaki Corp Electrical harness
US4642421A (en) * 1984-10-04 1987-02-10 Amp Incorporated Adhesive electrical interconnecting means
JPS6188136A (ja) * 1984-10-05 1986-05-06 Nec Corp 半導体マルチバイオセンサの製造方法
JPS60191228A (ja) * 1984-10-29 1985-09-28 Seiko Epson Corp 表示装置の接続構造
JPS61194896A (ja) * 1985-02-25 1986-08-29 ソニ−ケミカル株式会社 接続構造体
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US4808112A (en) * 1986-09-25 1989-02-28 Tektronix, Inc. High density connector design using anisotropically pressure-sensitive electroconductive composite sheets

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19619891C2 (de) * 1996-05-17 2001-07-26 Gkn Viscodrive Gmbh Vorrichtung zur Steuerung einer Kupplung

Also Published As

Publication number Publication date
US4958050A (en) 1990-09-18
JPH01167074U (en]) 1989-11-22

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